Senior Mechanical Engineer – Semiconductor Packaging

Cork | Permanent

The Role

An exciting opportunity has arisen for a Senior Mechanical Engineer to join a global technology organisation with an established semiconductor engineering operation in Cork.

You will take technical ownership of semiconductor packaging development from concept through qualification and into volume production, working across mechanical design, materials, thermal performance and manufacturing.

The role focuses on developing high-performance packaging solutions for RF and microwave semiconductor products, collaborating with design, quality, reliability, supply chain and manufacturing teams globally.

Key Responsibilities

• Lead the development of mechanical and semiconductor packaging solutions from concept through to production.

• Optimise packaging designs for thermal performance, mechanical integrity, cost, manufacturability, yield and quality.

• Work with design, quality, reliability, suppliers and contract manufacturers to develop and qualify packaging technologies.

• Establish and maintain packaging design rules and Design for Manufacture (DFM) guidelines.

• Lead packaging design reviews and support engineering build and qualification activities.

• Troubleshoot packaging and assembly defects, conduct failure analysis and implement corrective actions.

• Support tooling development and robust assembly processes for high-volume manufacturing.

• Analyse the impact of materials and processes on package performance and reliability.

• Manage multiple development projects and communicate technical progress to engineering and business stakeholders.

Technical Expertise

• Strong experience in semiconductor packaging and assembly processes, such as die attach, wire bonding, flip chip, wafer processing, surface mount and package assembly.

• Experience with RF, microwave or high-frequency semiconductor products.

• Strong understanding of materials, mechanical design, thermal performance and package reliability.

• Experience in process development, troubleshooting, failure analysis and continuous improvement.

• Knowledge of Six Sigma methodologies such as PFMEA, DOE, SPC and process mapping.

• Strong CAD skills using SolidWorks, AutoCAD or similar.

• Experience with thermal/mechanical FEA would be advantageous.

• Minitab or JMP experience would be beneficial.

Experience & Qualifications

• Bachelor’s degree with 8+ years’ relevant experience, or Master’s degree with 6+ years’ experience, in Mechanical Engineering, Materials Science, Electrical/Electronic Engineering or a related discipline.

• Proven experience in semiconductor packaging, package development or assembly process engineering.

• Experience taking packaging concepts from development through qualification and into production.

• Strong project leadership and problem-solving skills.

• Experience working with suppliers and international manufacturing partners.

• Excellent communication and presentation skills.

• Willingness to travel internationally.

What’s on Offer

• Technical ownership of complex semiconductor packaging and mechanical engineering programmes.

• Work at the intersection of mechanical engineering, materials, thermal design and semiconductor technology.

• Exposure to advanced RF and microwave technologies and global manufacturing operations.

• Opportunity to influence packaging technology and future development roadmaps.

• A technically challenging environment with strong opportunities for development and progression.

Location: Cork
Travel: International travel required